Sign In | Join Free | My cameraphonesplaza.com
cameraphonesplaza.com
Hunan LEED Electronic Ink Co., Ltd
Lively, Efficient, Excellent, Devoted Persuit common development of company benefit and corporate ethics
Home > Thermal Conductive Paste >

35 - 45 Pa.S Viscosity Silver Paste Thermal Conductivity Low Curing Temperature

Hunan LEED Electronic Ink Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

35 - 45 Pa.S Viscosity Silver Paste Thermal Conductivity Low Curing Temperature

Brand Name : LEED-INK
Model Number : PG-FX series
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
MOQ : 1KG
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Supply Ability : 50000KG per month
Delivery Time : Within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars. Carton. Carton size: 39*26*17cm. G.W.:7.5KG/ Carton
Ag Content(%) : 55-65
Viscosity (Pa.S) : 35-45
Curing Temperature(℃) : 600-650
Fineness (μm) : ≤10
Sheet Resistance(mΩ/sq) : ≤10
Contact Now

Silver Thermal Conductive Paste for Terninal Electrodes of MLCI MLCC Chip NTC Thermistor


Description


LEED-INK silver paste PG-XF series is specially designed for multi-layer chip inductor(MLCI), multi-layer chip capacitors(MLCC), chip NTC thermistor, etc. It is with low curing temperature, which is perfectly suitable for multi-layer chip inductors. It has features of wide Ag content optional range that could provide customized cost-effective solution for customers application. It is Bi-free product and up to RoHS regulation.


Benefits


  • Low curing temperature, specially apply to Multi-layer chip inductor
  • Wide Ag content optional range, customized cost-effective solution provided
  • Bi-free, up to RoHS regulation

Specification


TestProperties
PG-XF1PG-XF2PG-XF3
Ag Content(%)55.5±1.760±1.765±1.7

Viscosity (Pa.S)

(Brookfield HBT,10rpm,25℃)

40±5
Curing Temperature(℃)600-650
Fineness (μm)≤10
Sheet Resistance(mΩ/sq)≤10

Paste Preparation


Fully stir the paste, deaerate it by deaerator or roll it over 16 hours by slow roll machine.


Drying Condition


Drying Temperature: 120-150℃

Drying Time: 10-20min


Curing Condition


Peak Temperature: 600-650℃, keep 10min;

Total curing time: 80-120min


Delivery and Storage


During transportation and storage should protect against the tide and contamination. Containers may be stored in a cool dark, dry and stable environment at room temperature, with their lids tightly sealed. The shelf life of the paste is 12 months. The used material should be collected and sealed up alone. Don’t mix with other untapped material. Pay attention to prevent moisture and impurities infiltration.



Product Tags:

thermal conductivity thermal paste

      

high thermal conductivity paste

      
China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

35 - 45 Pa.S Viscosity Silver Paste Thermal Conductivity Low Curing Temperature Images

Inquiry Cart 0
Send your message to this supplier
 
From:
Enter your email please.
To: Hunan LEED Electronic Ink Co., Ltd
Subject:
Message:
Characters Remaining: (0/3000)