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Good Solderability Electrically Conductive Paste For ALN Electrode

Hunan LEED Electronic Ink Co., Ltd
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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Good Solderability Electrically Conductive Paste For ALN Electrode

Brand Name : LEED-INK
Model Number : DT8502
Certification : ISO9001, ISO14001, ROHS
Place of Origin : CHINA
MOQ : 1KG
Price : Negociatable
Payment Terms : L/C, T/T, Western Union
Supply Ability : 5000KG/Month
Delivery Time : Within 7 days after payment confirmed
Packaging Details : 1 KG/ barrel, 6 barrels/ Carton. Carton Size: 39*26*17cm, G.W.: 7.5KG
Application : ALN Electrode
Drying : 150℃-150℃-150℃ -120℃/200(mm/min)
Firing : 850℃/10-12min
Welderability : The tin Area ≥95%
Adhesion (N/2×2mm2) : ≥30
Sheet Resistance (mΩ/sq) (@12μm fired thickness) : ≤ 3
Shelf Life : 6 months
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Good solderability 850 ℃ Fired Electrically Conductive Paste for ALN Electrode


Description


Our pastes DT8502 is an environmentally friendly product created as a substitute to lead solder. They have the highest level of thermal conductivity in the industry for high-density silver filling, as well as also possessing high electrical conductivity. Therefore, it has been favored by many customers since its development.


Advantage


1. High adhesiveness reliability with various types of ceramic substrates
2. Offers migration resistance and can be UL796 certified
3. Includes no Pd and offers superior anti sulfuration


Application


  • Piezoelectric Ceramics
  • Aluminium nitride substrate
  • Piezoelectric crystal electrode(Buzzer,Transducer,Piezoelectric ceramics
  • Chip Component
  • ALN (aluminium nitride) electrode

Specification


Test

Properties of DT8502

Viscosity (Pa.S) (NDJ-99, 4#, 10rpm, 25±0.5℃)

90-370
Fineness (μm)≤12

Screen Mesh (Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

150℃-150℃-150℃-120℃/200(mm/min)

Recommended Firing Conditions

850℃/10-12min
Sheet Resistance (mΩ/sq) (@12μm fired thickness)≤ 3

Welderability

(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder)

The tin Area ≥95%

Solder Resistance (times)

(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder)

≥1
Adhesion ((N/2×2mm2)≥30
Shelf Life

Six Months from Date of Shipme


Package


Our standard packing is: 1KG/Barrel, 6 Barrels/Carton. Carton size: 39*26*17cm.
If you need customized packing, pls contact us for details.


Why Choose Us?


1. We has over 15 years’ manufacturing experience in electronic paste product and 5 years of exporting experience. Our professionaland thoughtful after-sales service eliminates your worries.


2. All member in R&D Team with well-educated, and with professional electronic paste research background.


3. Regularly train the first-line operators for the paste products knowledge and the operation skills.


4. Dedicated to high quality, stable supply and considerate service.


5. To inform customers of price trends in the market timely.


6. Customiszed production for different paste electrical properties requirements.


Related Products Properties


TestProperties
DT8501DT8503DT8504

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

90-370
Fineness (μm)≤12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325
Leveling TimeAt room temperature, 2-3 min

Recommended

Drying Conditions

150℃-150℃-150℃-120℃/200(mm/min)

Recommended

Firing Conditions

850℃/10-12min
Sheet Resistance (mΩ/sq) (@12μm fired thickness)≤ 2.5≤ 4≤ 5
Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder)The tin Area ≥95%

Solder Resistance (times)

(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder)

≥1
Adhesion (N/2×2mm2)≥30
Shelf LifeSix Months from Date of Shipment

Product Tags:

electrical conducting paste

      

thermally conductive paste

      
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