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Silver Electrically Conductive Paste Excellent Solder Leach 75% Ag Content

Hunan LEED Electronic Ink Co., Ltd
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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Silver Electrically Conductive Paste Excellent Solder Leach 75% Ag Content

Brand Name : LEED-INK
Model Number : DT5502
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
MOQ : 1KG
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Supply Ability : 30000KG per month
Delivery Time : within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG / carton
Ag Content (%) : 75
Drying : 120-150℃/ >8min
Firing : 550℃/>10min
Fired Thickness(μm) : 12-16
Conductivity(mΩ/sq) : ≤3-5
Solder Resistance (times) (235°C, 10s, PbSn Solder) : ≥2
Adhesion((N/2×2mm2) : ≥20
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Strong Adhesion Silver Electrically Conductive Paste for GPS Dielectric Rod Antennas


Description


LEED-INK has formed an international R&D team with rich industry experience. Led by foreign experts, help customers improve the quality of products by leading technology products and self-built professional technical service team. And we have a full range of products, which can provide one-stop service to reduce procurement costs for customers.

DT5502 is a mesothermal sintered silver paste that designed on alumina ceramic, quartz glass substrate, chip component, consumed hybrid integrated thick film circuit, heating element,etc.


Application


It could be applied for various circuit boards, chip component electrodes, LED packages, thermoelectric modules, boards for power control modules, etc.


Advantage

  • Compatible without coat
  • Excellent solder leach
  • Good solderability
  • Good Conductivity

Typical Properties


Test


DT5502


Ag Content (%)

75

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

120-150℃/ >8min

Recommended Firing Conditions

550℃/ >10min

Fired Thickness(μm)

14±2

Conductivity(mΩ/sq)

≤3

Welderability

Excellent

Solder Resistance (times)

(235°C, 10s, PbSn Solder)

≥2

Adhesion/ Tape Pull

(3M Scotch Tape #600)

No Ag Transfer

Adhesion((N/2×2mm2)

≥20

Thinner

LEED DZ-XS

Shelf Life

Six Months

from Date of Shipment


Drying


The peak temperature of drying is 120~150℃, keep 8~10min.


Firing


Firing temperature 550℃, peak temperature time:10~12min.

The firing process includes:

200℃-300℃: Evaporation and sintering of organic solvent and resin

300℃-500℃: Fully sintered of resin

500℃-550℃: Binding phase soften; the silver layer sintered density


Compatibility


LEED-INK silver paste DT550X Series has good compatibility with resistor paste, dielectric paste.


Why Choose Us?


1. LEED-INK has a deep know-how and a strengthened experience linked to the development, production and use of special pastes based on precious metals, such as silver, palladium for a great variety of applications.


2. Regularly train the first-line operators for the paste products knowledge and the operation skills.


3. Superior testing equipment, simulate clients’ real feel, ensure every products meet customers real production requirement.


4. To follow orders and arrange shipping in time, providing complete documents for Customs clearance according to different export policies in different countries.


5. Ensure product with high quality and pre-commissioning before delivery.


Related Products Properties


Test


Properties



DT5501



DT5502



DT5503



DT5504



DT5505


Ag Content (%)

8075706560

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325

Leveling Time

At room temperature, 2-3 min

Recommended

Drying Conditions

120℃-150℃/>8min

Recommended

Firing Conditions

550℃/>10min

Film Thickness (μm)

12-16

Conductivity (mΩ/sq)

≤ 3

≤ 3

≤ 4

≤ 4

≤ 5

Welderability

Excellent

Excellent

Good

Good

Good

Soldering Resistance (times)

(235℃, 10s, PbSn Solder)

≥2

Adhesion((N/2×2mm2)

≥20

Shelf Life200±30

Six Months from Date of Shipment


Product Tags:

thermal conducting paste

      

thermally conductive paste

      
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