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Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh

Hunan LEED Electronic Ink Co., Ltd
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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh

Brand Name : LEED-INK
Model Number : DT5504
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
MOQ : 1KG
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Supply Ability : 30000KG per month
Delivery Time : within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG / carton
Ag Content (%) : 65
Drying : 120-150℃/ >8min
Firing : 550℃/>10min
Conductivity(mΩ/sq) : ≤4
Solder Resistance (times) (235°C, 10s, PbSn Solder) : ≥2
Adhesion((N/2×2mm2) : ≥20
Screen Mesh (Stainless steel/ Polyester Mesh) : 250~325
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Low Resistance Silver Electrically Conductive Paste for Chip Component


Description


The silver paste DT5504 is 65% Ag content silver electrically conductive paste for applications such as chip component with a lower firing temperature, usually in the 500-550 ℃ can be fired for the need for lower sintering temperature of the circuit, the sensor and electronic components electrode.

It has excellent electrical conductivity, reliable adhesion, in line with the latest environmental requirements with non-toxic substance.


Application


It could be applied for various circuit boards, chip component electrodes, LED packages, thermoelectric modules, boards for power control modules, etc.


Advantage

  • Strong Adhesion
  • Good Solderability
  • Excellent Ageing Resistance
  • Good Conductivity
  • Pb and Cd free

Specification


Test


DT5504


Ag Content (%)

65

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

120-150℃/ >8min

Recommended Firing Conditions

550℃/ >10min

Fired Thickness(μm)

14±2

Conductivity(mΩ/sq)

≤4

Welderability

Good

Solder Resistance (times)

(235°C, 10s, PbSn Solder)

≥2

Adhesion/ Tape Pull

(3M Scotch Tape #600)

No Ag Transfer

Adhesion((N/2×2mm2)

≥20

Thinner

LEED DZ-XS

Shelf Life

Six Months

from Date of Shipment


Why Choose Us?


LEED-INK has been specialized in development, production and sales of electronic paste for more than ten years. The company Strives to develop green, energy saving and excellent products to practice corporate value.


We have formed an international R&D team with rich industry experience. Led by foreign experts, help customers improve the quality of products by leading technology products and self-built professional technical service team. And we have a full range of products, which can provide one-stop service to reduce procurement costs for customers.


Related Products Properties


Test


Properties



DT5501



DT5502



DT5503



DT5504



DT5505


Ag Content (%)

8075706560

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325

Leveling Time

At room temperature, 2-3 min

Recommended

Drying Conditions

120℃-150℃/>8min

Recommended

Firing Conditions

550℃/>10min

Film Thickness (μm)

12-16

Conductivity (mΩ/sq)

≤ 3

≤ 3

≤ 4

≤ 4

≤ 5

Welderability

Excellent

Excellent

Good

Good

Good

Soldering Resistance (times)

(235℃, 10s, PbSn Solder)

≥2

Adhesion((N/2×2mm2)

≥20

Shelf Life200±30

Six Months from Date of Shipment


Product Tags:

electrical conducting paste

      

thermal conducting paste

      
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Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh Images

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