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Low Temperature Silver Paste For Tantalum Capacitors Low Volume Resistivity

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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Low Temperature Silver Paste For Tantalum Capacitors Low Volume Resistivity

Brand Name : LEED-INK
Model Number : DT1203
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Delivery Time : Within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Solid Content (%) : 58-68
Drying : 130℃/30min + 180℃/30min
Adhesion/ Tape Pull (3M Scotch Tape #600) : No Ag Transfer
Solderability : Dip Soldering Area: >90%
Dip Soldering Condition : Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min)
Volume Resistivity : <2.4×10-4Ω·cm
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One Component Low Volume Resistivity Low Temperature Silver Paste for Tantalum Capacitors


LEED-INK silver conductive paste DT1203 is a general purpose one component coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

It has features of low volume resistivity, good adhesion, excellent solder resistance, high electrically conductivity, etc.


The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

It is designed to exhibit good adhesion and excellent solder resistance purposes.



Viscosity (Pa.S)

(10rpm, 25℃, 2min)

Solid Content63±5%
Drying Temperature & Time130℃/30min + 180℃/30min
Dip Soldering Condition

Sn92 Ag 3.5cu0.5

230℃-240℃ 1-5min

SolderabilityDip Soldering Area: >90%
Volume Resistivity<2.4×10-4Ω·cm
Adhesion3M #600 Tape *1min, vertical pull, no Ag Transfer
Shelf Life

Six Months

from Date of Shipment

Feature Advantage

1. High Electronic Conductivity

The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.

2. Good adhesion

The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.

3. Excellent Solder Resistance

The silver paste DT1203 exhibits excellent solder resistance, and the dip soldering area is up to 90%.

4. Good printing properties

The paste is with proper viscosity, good thixotropy and levelling properties which enables excellent printing properties. After screen printing, the film is well-distributed, fine and smooth.

5. Environmental friendly, up to RoHS regulation

The low temperature silver paste contains no toxic materials and heavy metal ions such as lead, Cadmium, nickel, and it is environmental friendly and meet environmental standard of RoHS regulation.

6. Low Consumption

the low temperature silver paste DT1203 is specially developed for low temperature curing applications. By years of improvement, we are keeping develop and reduced the noble metal content to reduce the cost and provide most cost efficient materials to the market.

Product Tags:

thermal paste silver


nano silver paste

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