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120℃ Drying Low Temperature Silver Paste Excellent Solder Resistance

Hunan LEED Electronic Ink Co., Ltd
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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

120℃ Drying Low Temperature Silver Paste Excellent Solder Resistance

Brand Name : LEED-INK
Model Number : DT1203
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
MOQ : 1KG
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Delivery Time : Within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Solid Content (%) : 58-68
Drying : 130℃/30min plus 180℃/30min
Adhesion/ Tape Pull (3M Scotch Tape #600) : No Ag Transfer
Solderability : Dip Soldering Area: >90%
Dip Soldering Condition : Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min)
Volume Resistivity : <2.4×10-4Ω·cm
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Excellent Solder Resistance 120℃ Drying Low Temperature Silver Paste

for Tantalum Electrolytic Capacitors


Description


LEED-INK silver conductive paste DT1203 is a general purpose coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

It has features of excellent solder resistance, high electrically conductivity, good adhesion, low consumption, etc.


Application


The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

It is designed to exhibit excellent solder resistance, high conductivity, good adhesion and purposes.


Specification


TestProperties

Viscosity (Pa.S)

(10rpm, 25℃, 2min)

0.5-10
Solid Content63±5%
Drying Temperature & Time130℃/30min + 180℃/30min
Dip Soldering Condition

Sn92 Ag 3.5cu0.5

230℃-240℃ 1-5min

SolderabilityDip Soldering Area: >90%
Volume Resistivity<2.4×10-4Ω·cm
Adhesion3M #600 Tape *1min, vertical pull, no Ag Transfer
Hardness≥2H
Shelf Life

Six Months

from Date of Shipment


Feature Advantage


1. Excellent Solder Resistance

The silver paste DT1203 exhibits excellent solder resistance, and the dip soldering area is up to 90%.


2. High Electronic Conductivity

The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.


3. Good adhesion

The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.


4. Good Hardness

Test the hardness of a standard line with a pencil hardness tester, the hardness of silver paste DT1203 is equal to or greater than 2H. It presents good hardness property of the silver paste.


5. Environmental friendly, up to RoHS regulation

The low temperature silver paste contains no toxic materials and heavy metal ions such as lead, Cadmium, nickel, and it is environmental friendly and meet environmental standard of RoHS regulation


Product Tags:

silver conducting paste

      

nano silver paste

      
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