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Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature

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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature

Brand Name : LEED-INK
Model Number : DT1203
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
MOQ : 1KG
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Delivery Time : Within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Viscosity : 0.5-10Pa.S
Solid Content (%) : 58-68
Drying : 130℃/30min + 180℃/30min
Adhesion/ Tape Pull (3M Scotch Tape #600) : No Ag Transfer
Pencil Hardness(H) : ≥2
Solderability : Dip Soldering Area: >90%
Dip Soldering Condition : Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min)
Volume Resistivity : <2.4×10-4Ω·cm
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High Electrically Conductivity Low Temperature Silver Paste for Tantalum Electrolytic Capacitors


Description


LEED-INK silver conductive paste DT1203 is a general purpose coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC). It has features of high electrically conductivity, low consumption, high heat-resistance, etc.


Application


The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

It is designed to exhibit good adhesion and low consumption purposes.


Specification


TestProperties

Viscosity (Pa.S)

(10rpm, 25℃, 2min)

0.5-10
Solid Content63±5%
Drying Temperature & Time130℃/30min + 180℃/30min
Dip Soldering Condition

Sn92 Ag 3.5cu0.5

230℃-240℃ 1-5min

SolderabilityDip Soldering Area: >90%
Volume Resistivity<2.4×10-4Ω·cm
Adhesion3M #600 Tape *1min, vertical pull, no Ag Transfer
Hardness≥2H
Shelf Life

Six Months

from Date of Shipment


Feature Advantage


1. High Electronic Conductivity

The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.


2. Low heat-drying temperature

The low temperature curing conductive silver paste refers to the silver paste with drying temperature of 100-200℃. And LEED-INK silver paste DT1203 is suggested drying process of 130℃/30min plus 180℃/30min.


3. Good adhesion

The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.


4. Good Hardness

Test the hardness of a standard line with a pencil hardness tester, the hardness of silver paste DT1203 is equal to or greater than 2H. It presents good hardness property of the silver paste.


5. High Cost Efficient

the low temperature silver paste DT1203 is specially developed for low temperature curing applications. By years of improvement, we are keeping develop and reduced the noble metal content to reduce the cost and provide most cost efficient materials to the market.


Product Tags:

thermal paste silver

      

nano silver paste

      
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Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature Images

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