Sign In | Join Free | My cameraphonesplaza.com
cameraphonesplaza.com
Hunan LEED Electronic Ink Co., Ltd
Lively, Efficient, Excellent, Devoted Persuit common development of company benefit and corporate ethics
Home > Solar Cell Paste >

Pb Cd Free Front Contact Ag Paste , ISO9001 Approval Metallization Paste

Hunan LEED Electronic Ink Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Pb Cd Free Front Contact Ag Paste , ISO9001 Approval Metallization Paste

Brand Name : LEED-INK
Model Number : ZY01
Certification : ISO9001, ISO14001, SGS
Place of Origin : China
MOQ : 1KG (200g for sample test)
Price : Negociatable
Payment Terms : L/C, T/T, Western Union, Paypal
Supply Ability : 30000KG per month
Delivery Time : Within 7 days after payment confirmed
Packaging Details : 1KG / Plastic can, 6 cans/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Solid Content (%) : 87-92
Fineness(μm) : <10
The rheological index (1rpm/10rpm) : 5.0-7.0
Solderability : Excellent
Shelf Life : 6 months
Contact Now

Pb and Cd Free Front Contact Silver Metallization Solar Cell Paste

for Solar Cell manufacturing


Description

LEED-INK front side silver metallization pastes are customizable to your process, thus increasing efficiency and fill factor while providing wider processing windows. ZY01 Series Silver-based paste for forming front ohmic contacts using the screen-printing technique on mono- and multicrystalline silicon wafers.

Contact us to speak an expert solar photovoltaic materials engineers and get help identifying the best silver paste for your solar cell application.


Application

LEED-INK front side silver pastes are formulated with highly conductive silver powders and have excellent printing properties, leading to higher yields with reduced silver consumption.


Specification

TestProperties
Solid Content (%)87-92

Viscosity (Pa.S)

(Brookfield HBT, 25℃, 10rpm )

270-480
Fineness(μm)<10

The rheological index

(1rpm/10rpm)

5.0-7.0
SolderabilityExcellent
Shelf LifeSix Months from Date of Shipment

Features

  • Outstanding printability and yield after metallization
  • Excellent match ability with various MCF parameters
  • Adapted to both Multi and Mono wafer, verified by broad massive production
  • Higher aspect ratio for finger lines with lower laydown
  • Higher cell efficiency distribution generates increased module value

FAQ

Q1:How long have your company run on electronic paste?
A: Over 15 years focusing on electronic paste field, 5 years exporting experience.

Q2: When can I get quotation for my inquiry?

A: Usually within 24 hours!

Q3: Can I get a sample?
A: Yes, sample is available. If noble metal such as Ag, Pd included, and the material cost is already high, we do not offer free samples.

Q4: How long does it take to the goods arrived?
A: Usually we will arrange the shipment withinin 3 to 7 days.

Q5: What payment terms is acceptable to you?
A: T/T, Western Union, Paypal, and L/C.

Q6: How do you treat quality complaint?
A: First of all, our QC department will do strict examination of our export products in order to reduce the quality problem to near zero. If there is a real quality problem caused by us, we will undertake all the expense of replacement.


Product Tags:

silver thermal paste

      

aluminium solder paste

      
China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

Pb Cd Free Front Contact Ag Paste , ISO9001 Approval Metallization Paste Images

Inquiry Cart 0
Send your message to this supplier
 
From:
Enter your email please.
To: Hunan LEED Electronic Ink Co., Ltd
Subject:
Message:
Characters Remaining: (0/3000)